TDA7052A DATASHEET PDF

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There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities.

In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature Tstg max.

If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SO Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste a suspension of fine solder particles, flux and binding agent to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt.

Dwell times vary between 50 and seconds depending on heating method. Preheating is necessary to dry the paste and evaporate the binding agent. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Use only a low voltage soldering iron less than 24 V applied to the flat part of the lead.

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There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

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